Defect Analysis - An Important Step To Improving Product Quality, Manufacture Process
Defect analysis is an industry process that plays a crucial role in product manufacturing. This critical step is done through the help of advanced equipment that are capable of examining defects at micro and nano levels. Improving the manufacturing process is one of the benefits defect analysis provides, which serves a key role to producing products that are of better quality. With that, we can say that defect analysis is crucial to delivering products with optimum performance to the end-users.
One example industry that is benefiting from defect analysis is semiconductor's. With this important step, manufacturers of integrated circuits are now able to detect even the slightest defect and perform the necessary fixing, thereby producing end-products that are of better quality. Because defect analysis involves the examination of semiconductor substrates in micro or nano levels, the process can be really challenging. Fortunately, companies that perform defect analysis have found solutions to this challenge and this is through the use of nano technologies developed by innovative minds in the industry. Some examples of these technologies are FE-SEM, which is utilized to capture the surface topology of any solid material with high spatial resolution; FIB-SEM, which is used for site-specific analysis, deposition, and ablation of materials.
Some microscopes used for defect analysis
Helios NanoLab(TM) DualBeam - this technology was developed to deliver a powerful solution for advanced nanoscale research; it has the capacity of producing ultra-thin samples for S/TEM and the most accurate prototyping capabilities.
Tecnai(TM) TEM - an equipment designed to provide a truly universal imaging and analysis solution; this is intended for life sciences, material sciences, nanotechnology and the semiconductor, as well as data storage industries.
Magellan XHR SEM - provides surface-sensitive imaging performance at sub-nanometer resolution, without compromising the analytical capabilities.
Advanced methods for defect analysis
3D Metrology - this method is used to measure the interior of complex object non-destructively; a system employed to process control, component qualification, reverse-engineering, as well as tool correction.
Circuit Edit - semiconductor companies use focused ion beam (FIB) tools in performing circuit edit, microsurgery on integrated circuit devices.
Failure Analysis - with the help of this process, a company is able to collect and analyze data to examine the cause of failure.
TEM Lamella Preparation - also uses focused ion beam to perform the process, it also includes FIB milling and polishing of front side of TEM lamella, then sample is rotated 180 degrees, which is milled and polished as well; then, pick up of TEM lamella with lift-out tool.
One example industry that is benefiting from defect analysis is semiconductor's. With this important step, manufacturers of integrated circuits are now able to detect even the slightest defect and perform the necessary fixing, thereby producing end-products that are of better quality. Because defect analysis involves the examination of semiconductor substrates in micro or nano levels, the process can be really challenging. Fortunately, companies that perform defect analysis have found solutions to this challenge and this is through the use of nano technologies developed by innovative minds in the industry. Some examples of these technologies are FE-SEM, which is utilized to capture the surface topology of any solid material with high spatial resolution; FIB-SEM, which is used for site-specific analysis, deposition, and ablation of materials.
Some microscopes used for defect analysis
Helios NanoLab(TM) DualBeam - this technology was developed to deliver a powerful solution for advanced nanoscale research; it has the capacity of producing ultra-thin samples for S/TEM and the most accurate prototyping capabilities.
Tecnai(TM) TEM - an equipment designed to provide a truly universal imaging and analysis solution; this is intended for life sciences, material sciences, nanotechnology and the semiconductor, as well as data storage industries.
Magellan XHR SEM - provides surface-sensitive imaging performance at sub-nanometer resolution, without compromising the analytical capabilities.
Advanced methods for defect analysis
3D Metrology - this method is used to measure the interior of complex object non-destructively; a system employed to process control, component qualification, reverse-engineering, as well as tool correction.
Circuit Edit - semiconductor companies use focused ion beam (FIB) tools in performing circuit edit, microsurgery on integrated circuit devices.
Failure Analysis - with the help of this process, a company is able to collect and analyze data to examine the cause of failure.
TEM Lamella Preparation - also uses focused ion beam to perform the process, it also includes FIB milling and polishing of front side of TEM lamella, then sample is rotated 180 degrees, which is milled and polished as well; then, pick up of TEM lamella with lift-out tool.
About the Author:
Roy Van Rivero had worked in a high-tech company for several years before venturing to online writing jobs. He leverages his experience in writing technology-related topics like defect analysis and FE-SEM. To learn more, visit Nanolab Technologies - a site administered by a company that provides knowledge-based analytical services.
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